A solder material is formed utilizing a transient liquid phase sintering process, where a precursor material is first formed.
采用瞬间液相烧结工艺来形成焊接材料,其中首先形成前体材料。
The latest developments of application of transient liquid phase bonding technique to pipe welding during recent years in Japan are introduced, and its reasons are analysed.
介绍了近年来日本在采用瞬间液相扩散焊焊管方面的一些进展,并综合分析了其原因。
A new welding process, the transient liquid phase (TLP) bonding, is applied to joint drill pipes in order to overcome the shortcomings of the friction welding.
针对石油鉆桿摩擦焊中存在的缺陷,研究了鉆桿瞬时液相扩散焊技术。
The latest developments of applicalion of transient liquid phase bonding technique to pipe welding during recent years in Japan are introduced, and its reasons are analysed.
介绍了近年来日本在采用瞬间液相扩散焊焊管方面的一些进展,并综合分析了其原因。
Research showed that: during the transient liquid phase diffusion bonding process, there exists a critical value about the choice of the bonding pressure.
研究表明:瞬时液相扩散连接中,压力的施加降低了液相的最大宽度,同时降低了降熔元素的总量,可以减少完成等温凝固所需要的时间。