this paper simply described the process inspection of automation al wire ultrasonic wedge bonding in ceramic packaging ic.
本文简要描述了陶瓷外壳封装集成电路自动铝丝楔焊键合的工序检查。
based on the experimental results, the models of the ultrasonic wedge bonding process and the interfacial bonding characteristics were illustrated.
给出了超声楔形键合接合过程和界面特征的模型。
ultrasonic wedge bonding is one of the most important interconnection techniques for ic dies inner circuits with the outer world of the power and signal transportation.