in ultrasonic wire bonding process, the bonding pressure is one of the most important factors to the bonding strength.
在超声引线键合过程中,键合力是影响键合强度的重要因素之一。
according to the circuit of ultrasonic wire bonding experiment platform, a piezoelectric transducer(pzt) driver signal acquisition circuit was designed.
根据超声引线键合实验平台电路结构,设计了pzt(压电陶瓷)驱动信号采集电路。
the paper takes the ic-encapsulation equipment—semi-automatic ultrasonic wire bonding machine as the control object.
论文正是以ic封装设备——半自动超声波焊线机为控制对象。
set up ultrasonic wire bonding laboratory.
成立超声波电子焊接实验室。
ultrasonic wire bonding is one of the most important technologies in chip interconnection of integrated circuits.